High-Precision Solder Paste Inspection Services | GreatPCB’s Advanced SPI Technology for Reliable SMT Quality
At GreatPCB, we understand that the foundation of a reliable and high-performing PCB assembly lies in the precision of every single process step—especially solder paste application. That’s why we integrate cutting-edge solder paste inspection (SPI) technology into our surface mount technology (SMT) workflow to ensure flawless manufacturing outcomes for every client, every time. Solder paste inspection is one of the most critical quality assurance steps in the PCB assembly process. It allows us to detect and correct printing issues—such as insufficient paste, excessive deposition, bridging, and misalignment—before components are placed. This proactive approach helps prevent costly rework, ensures the longevity of the board, and supports a significantly higher first-pass yield rate. At GreatPCB, we use 3D SPI systems that provide high-speed, high-resolution inspection of every pad and paste deposit on your board. Our systems measure paste height, volume, area, and shape in real ...